SOLDERING & SURFACE MOUNT TECHNOLOGY

英文简介

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches. Among the range of topics covered are:Soldering science and technologyNovel soldering processes and new solder alloysSurface mount technology (SMT)Surface mount assemblyAdvanced packaging technologies and 3D interconnectsFlip chip/BGA/SiP/TSVNovel substrates and embedded componentsSolderable finishes and coatingsScreen printingConductive adhesives and conformal coatingsReliabilityQuality controlInspection and testingRework and repairEnvironmental aspects

中文简介

焊接和表面贴装技术致力于在这一重要领域的知识和专业技术体系内对研究和应用的进展作出重要贡献。焊锡和表面贴装技术是其姊妹出版物，电路世界和微电子国际。该杂志包括一个多学科研究的关键材料和技术用于组装最先进的功能性电子设备。重点是通过焊接组装设备和互连组件，同时还包括广泛的相关方法。涵盖的主题范围包括：焊接科学与技术新的焊接工艺和新的焊接合金表面贴装技术表面安装组件先进的封装技术和3D互连倒装芯片/BGA/SIP/TSV新型基板和嵌入式组件可焊表面和涂层丝网印刷导电粘合剂和保形涂层可靠性质量控制检验和测试返工和修理环境因素

中科院分区

JCR分区

影响因子趋势图

JCR分区趋势图